ThermoFlexX at LabelExpo Asia 2019, 3 – 6 December

05 November 2019

Come and meet us during LabelExpo Asia in the Shanghai NIEC fair in order to discover our unique Surface Screening technology, ThermoFlexX Woodpecker Nano. You can also experience our state of the art development of our ThermoFlexx TFxX 30 digital imager for flexo plates dedicated to the Label industry. Hall E3, booth O44.